Various cooling solutions are available to address the thermal management needs of electronic equipment. The choice of cooling method depends on factors such as equipment size, power density, environmental conditions, and cost considerations.
In today’s fast-paced and high-demand environment, electrical equipment is constantly pushed to its limits, generating significant heat.
Overheating can cause components to degrade faster, increasing maintenance costs and downtime. To address this challenge, companies must prioritize implementing robust thermal management solutions that effectively dissipate heat and maintain optimal operating temperatures.
Effective thermal management is not without its challenges. One of the most common challenges is limited space within electrical equipment enclosures. As technology evolves, equipment becomes more compact, leaving little room for traditional cooling methods.
Another challenge is the increasing power density of electrical equipment. Higher power densities generate more heat in a smaller space, making dissipating more difficult. This requires innovative cooling solutions that can handle the higher heat loads without compromising performance.
Additionally, environmental factors such as ambient temperature, humidity, and dust can impact the performance of cooling systems. These factors must be considered when designing and implementing thermal management solutions to ensure optimal performance and longevity of electronic equipment.
Heatex offers two types of plate heat exchangers suitable for thermal management solutions: crossflow and counterflow.
In a crossflow exchanger, the cold and the warm air flow perpendicular to each other. In a counterflow exchanger, the two airstreams flow in opposite directions. The application determines which heat exchanger type provides the best solution.
Model H2 is our most efficient crossflow plate heat exchanger. It combines low weight with high differential pressure resistance and can reach typical dry temperature efficiencies above 80%.
Heatx Crossflow Heat ExchangersModel M is a lightweight counterflow exchanger specifically developed for thermal management. It offers customizable aspect ratios and multiple flow path configurations. It’s manufactured of aluminum with Aluzinc steel casings.
Heatex Counterflow Heat ExchangersOur skilled and experienced application engineers support our customers during the entire development process, from start to finish.
Let us know your challenge, and we will increase your competitiveness.
Ask an ExpertThousands of Heatex plate heat exchangers are operating in enclosures all over the world.
Many years of experience supplying plate heat exchangers for electronic cooling applications.
With production facilities in Europe, the US and China we are always close and accessible.